2K11x4.5 KPTD-2 / 1-0.2, Heat-conducting dielectric substrate for quartz
Images are for reference only,
see technical documentation
see technical documentation
SKU
4148
Brand
Type of device housing
non-standard
Features
without sticky layer
Thickness, mm
0.22
Weight, g
0.03
Thermally conductive substrates NOMACON
pdf, 180 КБ
158 pcs. from the central warehouse, term 7 days
152 ֏
83 ֏
from 500 pcs. —
71 ֏
1 pcs.
amount of 83 ֏
Designed for electrical insulation and heat removal from fuel elements of electronic devices, as well as structures and components that heat up during operation. They are made of heat-conducting ceramics on a silicon-organic bond.
They are used to isolate the mounting surfaces of semiconductor devices during installation, as well as a dielectric material in electronics, electrical engineering and heat engineering. They are used instead of mica and heat-conducting paste KPT-8.
Specifications
| Name of indicator | Meaning |
| Thermal conductivity, W/(m*K) | one |
| Electrical strength, kV/mm: | |
| at alternating voltage, not less | ten |
| at constant voltage, not less than | fifteen |
| Dissipation tangent, at 1000 Hz | (4-4.5)*10-3 |
| Dielectric constant, at 1000 Hz | 5.9-6.2 |
| Specific volume electrical resistance, Ohm * cm, not less than | 1014 |
| Density, g/cm3 | 1.9-2.0 |
| Operating temperature range,°C | -60 to +250 |
Technical parameters
| Type of device housing | non-standard | |
| Features | without sticky layer | |
| Thickness, mm | 0.22 | |
| Weight, g | 0.03 |
Technical documentation
Thermally conductive substrates NOMACON
pdf, 180 КБ
Delivery terms
Delivery to Yerevan
| Office CHIP AND DIP | 24 November1 | free |
| HayPost | 28 November1 | 1 650 ֏2 |
1 estimated delivery date depends on the date of payment or order confirmation
2 for parcels weighing up to 1 kg
